Quad-Core Chips: Intel announces the 3rd generation of Intel Core

Intel Corporation has announced its new range of quad-core processors of the 3rd generation of Intel Core.

These new processors are available in designs suitable for powerful desktops , portable and stylish integrated teams (AIO), and are the first chips in the world to use technology Tri-Gate transistors Intel 3D, in the process of 22 nanometers (nm).


The combination of 3D transistor technology Tri-Gate and architectural enhancements can double performance 3D graphics and HD media processing chip compared to the previous generation of Intel. Thanks to the integrated graphics performance, everything users do on your PC, from creating and editing videos and pictures to browse and view HD movies, play games via conventional, more agile, fast and realistic. Hand in hand with up to 20% improvement in performance and new technologies to streamline the flow of input and output chips, these new processors expand, more if possible, the leadership of Intel in overall performance. In the Over the next few months, Intel will offer more versions of the processors of the 3 rd generation Intel Core, which will be the heart of a whole new wave of systems, from systems Ultrabook ™, to servers and intelligent systems for retail, health and other sectors.

“The 3rd generation of Intel Core has been created entirely in order to offer new and exciting experiences,” said Kirk Skaugen, Intel vice president and general manager of PC Client Group Company. “Our engineers have surpassed our expectations by doubling and multimedia graphics performance on the best processors were offering to date, resulting in stunning graphical experiences never seen before, for the next integrated PC (AIO) and Ultrabook ™ systems. What has made all this possible is the combination of Intel’s leadership in production and processor architecture, coupled with his unwavering commitment to constant innovation computing. ” “Tick-Plus”: the advantage of Intel ‘s increased performance of these new processors is due in part to the revolutionary new three dimensional structure of the new Intel transistors. To date, computers, servers and other devices have been used transistors only two-dimensional planes. With the addition of a third dimension to transistors, Intel has been able to increase its density in the chip, providing the greatest potential to each square millimeter of these new processors. Once again, Intel has re-invented the transistor, offering an unprecedented combination of performance and energy efficiency, which the company continues to stimulate the pace of technological progress and enabling the fulfillment of Moore’s Law for years to come.

In addition, Intel engineers have redesigned the graphics architecture of the 3rd generation of Intel Core, thereby offering dramatic overall improvements in the visual experience user. Changes in the architecture of the chip, made ​​while the process of miniaturization of transistors that comprise it, are an acceleration model “tick-tock” development at Intel. So far, the company has adhered to a strict model of development “tick-tock”, which, if one year is introducing a new manufacturing process (the “tick”), the following year improved chip architecture (the “tock”). This ability to accelerate the development plan and progress, while the architecture and the process of production of the chips, made ​​possible by the fact that Intel is one of the few companies that are designing and producing its own chips, a method we call Integrated Device Manufacturing (Integrated Device or Production).